Amaprosesa | Kufika kuma-cores angu-56 anama-CPU angu-2x Intel® Xeon® Scalable |
Ikhadi lezithombe | Kufika ku-2x NVIDIA RTX™ A6000 noma 1x AMD Radeon™ Pro W6800 GPUs |
Inkumbulo | Kufika ku-1.5 TB DDR4-2933 ECC SDRAM |
Isitoreji | Kufika ku-56 TB |
Ukunikezwa kwamandla kagesi | Kufika ku-1700W |
Drives Bays | Okubili 5.25"; Okune 2.5" noma 3.5" |
Ubukhulu | 8.5 x 21.7 x 17.5 ku-21.59 x 55.12 x 44.45 cm |
Isisindo | Iqala ku-49.4 lb Iqala ku-22.4 kg |
Ukusebenza kwesivinini esiphezulu kuzwa amandla okucubungula anamandla
Sekela ama-processor we-Xeon amabili, ukusebenza okunamandla, akwazi wonke umsebenzi
Ngokusebenzisa ibhalansi yefrikhwensi, i-kernel nentambo, dala ukusebenza okuphezulu futhi uzwe amandla okucubungula anamandla
Izinto eziqinile, ubuciko obuqinile kanye nomklamo wesayensi
Isistimu enamandla yokukhipha ukushisa, ukususwa kokushisa okuzinzile nokusebenza kahle, umsindo ophansi, ukuze ube nendawo yokusebenza ethule.
Isitifiketi sokusebenza esigcwele se-ISV Dala inkundla yobungcweti
Isitifiketi se-ISV, esine-hardware ethuthuke kakhulu kanye ne-software ecosystem, abashayeli abaqinile abahlanganisiwe nabathuthukisiwe, kanye nesitifiketi se-ISV sezinhlelo zokusebenza zobungcweti ezingaphezu kwe-100, kusiza abaklami benze umsebenzi obalulekile, bathole isitifiketi esisebenza ngokugcwele sezinhlelo zokusebenza namathalente anjengomklamo wokumodela we-3D nobunjiniyela. ukwakhiwa kwe-BIM, futhi unikeze abasebenzisi inkundla ekahle yobungcweti ukuze babone ukuhamba komsebenzi kwamakhemikhali edijithali kwe-3D
Sekela isoftware ehlukahlukene yokuklama izithombe
Ukukhiqiza okunamandla, umsingathi wedizayini yezithombe ochwepheshe, osekela ihluzo ezihlukahlukene nokucutshungulwa kwezithombe, imiphumela ekhethekile yefilimu nethelevishini, ukucubungula ngemva kokucubungula, njll. yazalelwa ukuklama ukwenza ukuklama nokudala kube bushelelezi.